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Description
Features:
| CATEGORY | SPECIFICATIONS |
|---|---|
| Product Type | Solder Paste |
| Model | XG-Z40 |
| Type | Leaded solder paste |
| Alloy Composition | Tin-based alloy |
| Activity Level | Low |
| Viscosity | 1 Pa·s |
| Particle Size | 25–45 µm |
| Melting Point | 183°C |
| Operating Temp. | 183°C |
| Cleaning Type | No-clean (residue is colorless and transparent) |
| Residue Property | Does not affect inspection; excellent cleaning performance |
| Wettability | High wettability, ensures reliable solder joints |
| Shelf Life | Long shelf life at room temperature; strong anti-dry properties |
| Application | Mobile phone repair, computer repair, SMT PCB soldering, BGA soldering |
| Printing Performance | Stable printing, prevents collapse, supports fine pattern printing |
| Welding Quality | Bright, full solder joints; no false welding or missing joints |
| Special Feature | Thixotropic agents prevent collapse during preheating and printing |
Package Includes:
1 X solder paste
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