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Description
Features:
| CATEGORY | SPECIFICATIONS |
|---|---|
| Product Type | Solder Paste |
| Model | RMA-223 |
| Type | Moderately active rosin-type solder paste |
| Application | SMD rework process for mobile phone boards |
| Use Cases | BGA, CSP, and other ball array solder joint rework and ball replacement |
| Residue Type | No-clean |
| Residue Color | Very light |
| Electrical Property | High SIR (Surface Insulation Resistance) |
| Performance | Suitable for reliable, low-residue electronic rework |
Package Includes:
1 x RMA Solder Paste
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