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Description
Features:
| CATEGORY | SPECIFICATIONS |
|---|---|
| Product Name | 3D Printer Hot Bed High-Power Expansion Module |
| Design / Appearance | Compact, small footprint, aesthetic design |
| Purpose | Provides additional power for high-current heated beds |
| Maximum Current (Module) | Stable long-term operation up to 30A |
| MOSFET Performance | Nominal maximum current 280A |
| Heat Dissipation | Large heat sink for efficient cooling |
| Control Compatibility | Works with RAMPS 1.4, MKS series motherboards |
| Control Signal Voltage | 5–24V digital signal control |
| Advantages / Features | Functional tested before shipment; handles high bed current; efficient heat dissipation |
Package Includes:
- 1 x High power module
- 1 x Motherboard PWM 30CM signal control line
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